[High-tech LED News] It is reported that Hongkai Optoelectronics (Shenzhen) Co., Ltd. has invested in a new factory in Hengli, Dongguan. The new plant will mainly produce a full range of LED products. Among them, the production of high-power LED products is its leading direction in the future.
The new plant is expected to introduce 20 sets of equipment, and the monthly production capacity will be expanded to 230 million. The infrastructure construction and equipment installation and commissioning will be completed by the end of September this year, and will be officially put into operation in the first quarter of next year.
Hu Yongqing, executive vice president of Hongkai Optoelectronics, said that the company has made adjustments to its future development direction as early as 2006, focusing on research and development and production of high-power LED products, showing Hongkai's unique optical capabilities and packaging technology.
According to reports, Hongkai Optoelectronics has been in the leading position in the industry in the production technology of high-power LED products. In terms of packaging technology, Hongkai Optoelectronics introduced the eutectic technology currently only available to a small number of LED companies. By adopting the combination of chip and plate thermal block, the traditional silver paste is replaced by eutectic metal to reduce the thermal resistance of the LED. The thermal conductivity is 3~4 times higher than that of the silver glue process, which greatly reduces the heat accumulation and improves the LED performance. This technology is comparable to world-class LED companies such as CREE and OSRAM.
Hongkai Optoelectronics also independently developed a COB packaged light wall design technology. This light wall design technology uses a patented heat dissipation design substrate. Its thermoelectric separation structure design and package eutectic process can greatly reduce the thermal resistance. Light efficiency has increased by 8% from the previous level.
According to reports, Hongkai Optoelectronics has introduced a new product that uses a light wall design process, and its thermal resistance can be reduced to below 10 °C / W, which is also a major breakthrough in the industry. At present, the light wall design technology of this COB package is being patented.
At present, Hongkai Optoelectronics continues to develop new high-power LED products, focusing on the application of advanced technologies in the production of high-power LED products to the production of new plants. By then, more and better high-power LED products will be available.
Hongkai Group is a Taiwan-funded enterprise headquartered in Taiwan. Since its establishment in 2001, Hongkai Optoelectronics (Shenzhen) Co., Ltd. has been committed to professional R&D, manufacturing and sales of high-efficiency, low-energy LED energy-saving lighting products. The vast LED market in mainland China and overseas. In the next two years, Hongkai Optoelectronics will also set up subsidiaries in Beijing, Chengdu, Shenyang and other places to establish a more comprehensive sales channel for Hongkai Optoelectronics in the mainland.
The new plant is expected to introduce 20 sets of equipment, and the monthly production capacity will be expanded to 230 million. The infrastructure construction and equipment installation and commissioning will be completed by the end of September this year, and will be officially put into operation in the first quarter of next year.
Hu Yongqing, executive vice president of Hongkai Optoelectronics, said that the company has made adjustments to its future development direction as early as 2006, focusing on research and development and production of high-power LED products, showing Hongkai's unique optical capabilities and packaging technology.
According to reports, Hongkai Optoelectronics has been in the leading position in the industry in the production technology of high-power LED products. In terms of packaging technology, Hongkai Optoelectronics introduced the eutectic technology currently only available to a small number of LED companies. By adopting the combination of chip and plate thermal block, the traditional silver paste is replaced by eutectic metal to reduce the thermal resistance of the LED. The thermal conductivity is 3~4 times higher than that of the silver glue process, which greatly reduces the heat accumulation and improves the LED performance. This technology is comparable to world-class LED companies such as CREE and OSRAM.
Hongkai Optoelectronics also independently developed a COB packaged light wall design technology. This light wall design technology uses a patented heat dissipation design substrate. Its thermoelectric separation structure design and package eutectic process can greatly reduce the thermal resistance. Light efficiency has increased by 8% from the previous level.
According to reports, Hongkai Optoelectronics has introduced a new product that uses a light wall design process, and its thermal resistance can be reduced to below 10 °C / W, which is also a major breakthrough in the industry. At present, the light wall design technology of this COB package is being patented.
At present, Hongkai Optoelectronics continues to develop new high-power LED products, focusing on the application of advanced technologies in the production of high-power LED products to the production of new plants. By then, more and better high-power LED products will be available.
Hongkai Group is a Taiwan-funded enterprise headquartered in Taiwan. Since its establishment in 2001, Hongkai Optoelectronics (Shenzhen) Co., Ltd. has been committed to professional R&D, manufacturing and sales of high-efficiency, low-energy LED energy-saving lighting products. The vast LED market in mainland China and overseas. In the next two years, Hongkai Optoelectronics will also set up subsidiaries in Beijing, Chengdu, Shenyang and other places to establish a more comprehensive sales channel for Hongkai Optoelectronics in the mainland.
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