"Two years ago, chip-scale packaging (CSP) has been used more in the silicon integrated circuit industry due to its low cost and high performance." Zhou Xuejun, Marketing Director of Lumileds Asia, took the high-tech LED tour in Shanghai on April 28th . It is said that the current CSP light source has been widely used in large-angle light source products such as mobile phones, TV backlights, panel lights, street lamps and the like.
Lumileds is the global leader in light engines, enabling innovative, high-quality and sustainable LEDs and automotive lighting products to enable next-generation lighting developers to create truly groundbreaking products that drive the health of the LED industry. Continue to move forward.
Zhou Xuejun said that with the gradual maturity of the LED lighting market and the expansion of various application markets, there will be a very large market space for future CSP packaging products. "CSP packaging can be used to reduce the size of the device through large-scale production. Cost, to achieve greater capacity to meet market demand."
In addition, due to the increased level of mold processing, CSP small equipment enables cost-effective reduction, coupled with its simple and robust design without lead-free keys, which improves lumen density, effectiveness and reliability.
However, Zhou Xuejun believes that although CSP packaging is the future trend, but there are also integrated or independent devices such as SMD and COB on the market, CSP packaging will only occupy a certain share in the market and apply to certain specifics. Areas such as high optical density and areas where high light intensity is required.
Lumileds is the global leader in light engines, enabling innovative, high-quality and sustainable LEDs and automotive lighting products to enable next-generation lighting developers to create truly groundbreaking products that drive the health of the LED industry. Continue to move forward.
Zhou Xuejun, Marketing Director, Lumileds Asia
Zhou Xuejun said that with the gradual maturity of the LED lighting market and the expansion of various application markets, there will be a very large market space for future CSP packaging products. "CSP packaging can be used to reduce the size of the device through large-scale production. Cost, to achieve greater capacity to meet market demand."
In addition, due to the increased level of mold processing, CSP small equipment enables cost-effective reduction, coupled with its simple and robust design without lead-free keys, which improves lumen density, effectiveness and reliability.
However, Zhou Xuejun believes that although CSP packaging is the future trend, but there are also integrated or independent devices such as SMD and COB on the market, CSP packaging will only occupy a certain share in the market and apply to certain specifics. Areas such as high optical density and areas where high light intensity is required.
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