According to statistics from the China Association of Automobile Manufacturers, China's auto sales have grown rapidly, with an increase of 13% in April 2013 compared with the same period last year. At the same time, in order to stand out in this fiercely competitive market, auto manufacturers are constantly adding new functions to cars, and the electronic configuration used by each car is also increasing. To meet the needs of cost-effective automotive electronic systems, Freescale Semiconductor's S12 MagniV mixed-signal microcontroller (MCU) series portfolio provides Chinese automakers with highly integrated, single-chip solutions that are extremely reliable and easy to develop , At the same time help to reduce the cost of materials (BOM) and total manufacturing costs.
Jin Zhefeng, Senior Manager of SAIC's Technology Center, said: "The S12 MagniV single-chip solution has helped us achieve the same functions that previously required multiple devices, saving board space, reducing material costs, and enabling inter-device Compatibility has been greatly improved, making our design more reliable. "
In the past, automotive electronic system designs often required multiple components, including some MCUs manufactured using high-voltage processes, used to connect batteries and power actuators, and using low-voltage digital logic processes. This poses challenges for applications that are limited by space. The S12 MagniV MCU meets this challenge by integrating analog components and MCUs, providing a comprehensive single-chip solution for applications such as anti-pinch power window lifts, car dashboards, and brushless DC motors.
Automobile original equipment manufacturers combine the latest CAN and LIN-based S12 MagniV devices with the latest Qorivva MCU body control modules in a networked system to eliminate copper wiring and board components up to 20 pounds, reduce vehicle weight, and further improve fuel efficiency.
Mo Yongcong, Executive Director of Shanghai Industrial Transportation Electric Co., Ltd. (STEC) R & D Center, said: "Using Freescale S12 MagniV mixed-signal MCU to develop STEC second-generation anti-pinch window lift module can save costs and reduce board size. And accelerate the time to market. S12 MagniV devices go far beyond traditional multi-component solutions, allowing us to lead the way in the fierce market competition. "
With the deployment of the Joint Technology Lab, Freescale is accelerating the introduction of innovative designs into the automotive market. Freescale and Tongji University in Shanghai have jointly developed an anti-pinch window reference design that shows the power of the S12 MagniV product line. The reference design is based on the S12 MagniV S12VR MCU and is ideal for developing power window and sunroof systems.
In addition to cooperating with Tongji University, Freescale has also established a joint automotive laboratory in China with many partners, including Changan Automobile, Chery, Foton Motor, FAW and Dongfeng Motor. Through these partnerships and a large number of technical seminars held in China, Freescale helps to develop the Chinese automotive electronics market, provide customers with the support they need, help improve design efficiency and inspire new design inspiration.
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