Micron and Samsung will jointly develop "sandwich cookies" memory

Earlier, we mentioned the HMC (Hyper Memory Cube) memory technology developed by Micron. The company also cooperated with Intel on the IDF 2011 San Francisco Developer Forum to show related samples. On October 6, Micron announced that it will work with Samsung Electronics, the leader in the storage chip industry, to develop the new memory architecture of HMC. The goal is to make it practical as soon as possible and enter the stage of industrialized production.

The HMC is a new memory architecture scheme using a TSV (through silicon via) technology to stack multiple chips together and use a logic layer to control it. The memory bandwidth can be greatly increased, and the energy efficiency ratio is 7 times that of the current low voltage version of DDR3 memory, and the performance is 15 times as much.

The biggest challenge for HMC technology is the actual packaging of memory. It is believed that there will be corresponding solutions under the joint efforts of leading Intel, Micron, and Samsung in the industry.