After a heated discussion on the marketization of the CSP (Chip Scale Package) technology last year, the first half of this year witnessed renewed interest due to the transfer of a Japanese company’s fluorescent film technology. This has sparked another wave of attention within the industry.
Degao Huacheng recently signed a technical service agreement with Nitto Denko to handle the localization development and service of the second-generation conformal packaging CSP fluorescent film technology. Interestingly, just a few days prior, Zhongshan Stereo Optoelectronics announced its full acquisition of Nitto Dye’s fluorescent film project.
The CSP concept has been around for a few years now, but it hasn’t managed to create a significant impact until recently. Tan Gang, Vice President of Sales at Donghao Optoelectronics, noted, “New products often require new equipment, and CSP, as a novel packaging form, has faced challenges in gaining traction due to the declining profitability in the LED market. Many companies are hesitant to invest in new machinery, which slows down the overall growth.â€
Persistent efforts are essential for any new product to succeed, and Dongxun Optoelectronics has been a trailblazer in the CSP field since 2015. By increasing its investment in 2016, the company has consistently contributed to advancing CSP technology.
CSP products are primarily used in specialized applications like backlighting, flashlights, and automotive lighting. However, when compared to more common options like 2835, 3030, or 5730 packages in general lighting, CSP struggles to compete on price. Consequently, many manufacturers focused on general lighting remain观望.
Despite this, CSP remains a promising direction for LED packaging. As Tan Gang put it, “More and more companies are recognizing its potential, and several innovative firms have already begun mass production.â€
Dongxun Optoelectronics has successfully scaled up its CSP production, reaching capacities of 15-20 million pieces per month for products above 1W. With ongoing equipment upgrades, they aim to double this figure by year-end.
The high-end market's demand for CSP continues to grow, particularly in applications like car headlights, TV backlights, and mobile phone flashes. Tan Gang predicts further breakthroughs in areas like general lighting, specialty lighting, and consumer electronics.
In automotive lighting, CSP is particularly popular in the aftermarket, where cost reduction and ease of use are key considerations. Companies are increasingly offering CSP products in standardized sizes, which simplifies integration into existing systems.
Yimeixinguang’s Executive Vice President, Liu Guoxu, emphasized the need for standardization in CSP development. He stated, “Without a unified standard, the adoption rate slows down. If everyone adheres to a similar size, like the medium-power 2835 or 5630, the technology would spread faster.â€
Samsung took a step forward by introducing CSP LED modules with adjustable color temperatures. These modules enhance compatibility and offer greater flexibility for applications like spotlights and downlights.
As the market matures, modularization could drive the broader adoption of CSP in general lighting. Donghao Optoelectronics plans to launch its third-generation CSP products later this year, further refining the technology and meeting diverse customer needs.
This growing trend underscores the potential of CSP to transform LED packaging, offering both cost-effective solutions and innovative design possibilities.
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