How to monitor and measure current and voltage data in the smart grid

The “intelligence” in the smart grid comes from the measurement, control and communication functions that the grid has. Once the measurement is completed, an automatic and widely distributed grid that protects, monitors, and optimizes the operation of the interconnect components is generated between the distribution company and the user. This new automated network enables utility companies to respond more effectively to user needs and enables users to control power usage by continuously obtaining more information.

In today's complex power grids, the number of current and voltage channels that need to be monitored or measured is growing rapidly. What is directly related to this is how to handle the large number of analog inputs at hand, and then how to input the data into the processor without overburdening the processor interface after the signal is digitized.

A merging unit is an interface that uses a communication network to connect the physical analog world to the digital world. The analog signal is converted to a digital signal and transmitted over Ethernet over an IEC 61850-9-2 (sampled value) communication protocol.

TI's reference design for the analog front end (AFE) used in the merging unit (TIDA-00307) shows how to add multiple channels (8 at a time) by adding an additional successive-force register (SAR) analog-to-digital converter (ADC) Channels are added together in a modular way to increase signal processing power.

Simplified merging unit—measuring large amounts of current and voltage in the “smart grid”

Multiple ADCs can then be connected together using the daisy-chaining capabilities provided on the SPI and ADC to minimize interconnecting overhead from multiple ADCs to the controller.

The data throughput of the ADS8688 SAR ADC used in the reference design is 500kSPS. The device features an integrated analog front-end circuit for each input channel with overvoltage protection up to ±20V, an 8-channel multiplexer that supports both automatic and manual scan modes, and an on-chip 4.096V reference with very low drift. Operating from a single 5V analog supply, each input channel on the device supports true bipolar input ranges of ±2.56V, ±5.12V, and ±10.24V.

The device also offers a second-order anti-aliasing filter, an ADC driver amplifier and an extended industrial temperature range. In addition, this solution enables simultaneous sampling. When two devices are daisy-chained together and the same chip is asserted, the sampling delay between CH0 of ADC1 and CH0 of ADC2 will be minimized for sampling.

TI's solution shows how the merging unit can be implemented in a modular fashion, so that the number of channels can be easily increased as needed, and how the ADC and processor can be docked without excessively increasing the processor interface burden. In addition, this solution is compact, high-integration, and simultaneous sampling when using multiple ADCs.

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