LED heat dissipation method and heat dissipation material design introduction

The way to dissipate heat - mainly physical

1. Radiation radiation means that the body radiates heat by emitting infrared rays. When the skin temperature is higher than the ambient temperature, the heat of the body is dissipated by radiation. Radiation heat dissipation is related to factors such as skin temperature, ambient temperature and effective radiation area of ​​the body. In general, the radiative heat dissipation accounts for 40% of the total heat dissipation. Of course, if the ambient temperature is higher than the skin temperature, the body will absorb the radiant heat. Steel workers work in front of the furnace, and this is also the case when farmers work in the field under the heat of the summer in the hot summer.

2. Conduction and convection conduction is the body's ability to dissipate heat by transmitting molecular kinetic energy. When the human body is in direct contact with objects that are cooler than the skin (such as clothes, beds, chairs, etc.), the heat itself is transmitted to these objects. Clinically, using ice caps, ice packs, etc. to cool patients with high fever is to use this principle.

Convection is the flow of air, which uses air as a medium to dissipate heat.

Heat exchange between the radiator and the environment

When the heat is transferred to the top of the radiator, it is necessary to dissipate the heat to the surrounding environment as soon as possible. For the air-cooled radiator, it is necessary to exchange heat with the surrounding air. At this time, heat is transferred between two different media, and the formula according to it is Q=α XAX ΔT, where ΔT is the temperature difference between the two media, that is, the temperature difference between the heat sink and the ambient air; and α is fluid. The thermal conductivity, after the heat sink material and air composition are determined, it is a fixed value; the most important A is the contact area between the heat sink and the air. Under other conditions, such as the size of the heat sink, there will be Restricted, the space inside the chassis is limited, and the difficulty of installation is increased. However, by changing the shape of the heat sink, increasing the contact area with the air and increasing the heat exchange area, it is an effective means to improve the heat dissipation efficiency. To achieve this, the surface area is generally increased by using a fin design with surface roughening or threads.

When the heat is transferred to the air, the temperature of the air in contact with the heat sink will rise rapidly. At this time, the hot air should be taken away from the surrounding cold air by convection and other heat exchange methods. For the air-cooled radiator. The most important means is to increase the speed of air flow and use a fan to achieve forced convection. This is mainly related to the design of the fan and the wind speed. The performance of the radiator fan (such as flow rate and wind pressure) mainly depends on the fan blade diameter, axial length, fan speed and blade shape. The fan flow is mostly in CFM (inch, cubic feet per minute) and a CFM is about 0.028 mm3/minute.

Pure aluminum radiator

Pure aluminum radiators are the most common radiators in the early days. The manufacturing process is simple and the cost is low. So far, pure aluminum radiators still occupy a considerable part of the market. To increase the heat dissipation area of their fins, aluminum radiator means is the most common aluminum extrusion processing technology, LED lamp controller and a main indicators of the evaluation of the thickness of pure aluminum heat sink base and a heat sink than the Pin-Fin . Pin refers to the height of the fins of the heat sink, and Fin refers to the distance between two adjacent fins. The Pin-Fin ratio is the height of the Pin (excluding the thickness of the base) divided by Fin. The larger the Pin-Fin ratio, the larger the effective heat dissipation area of ​​the heat sink, which means that the aluminum extrusion technology is more advanced.

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