Micro-camera

A new type of word, this word is specifically created for the Chinese market. The micro-single has two meanings: micro, micro, small, single, single-lens camera, that is to say the word is that this camera has a small size and SLR general quality. That is, a miniature, compact camera with a single-lens reflex function is called a micro-camera.

Ordinary card digital cameras are very fashionable, but subject to aperture and lens size, there are always some beautiful scenery that cannot be taken; professional SLR cameras are too bulky. Just as there was a netbook between a laptop and a smart phone, between the card-type digital camera and the SLR camera, there was now a middleware that took advantage of both. Sony called it "micro-single," with a card. The compact body of a digital camera can be interchanged like a SLR camera and offers the same image quality as an SLR camera.

Before Sony introduced the micro-camera, consumer electronics giants such as Olympus, Panasonic, and Samsung have introduced related products. Different from Sony's name “micro-single”, Olympus, Panasonic, Samsung, etc. call this type of camera “single-power”. Although there is a difference in the name, Sony’s personal audio and video division’s director Yoshiro Akira’s representative said that “micro-single” is a name that is specifically determined for the Chinese market and can cover both micro and SLR: the camera is small, compact, portable, and Replace the lens like an SLR camera and provide the same image quality as an SLR camera. Since many manufacturers have successively targeted this market, the industry is also known in the industry as the first year of single-camera development.

HDI PCB Specification

High density interconnect (HDI) PCBs represent one of the fastest-growing segments of the printed circuit board market. Because of its higher circuitry density, the HDI PCB design is able to incorporate finer lines and spaces, smaller vias and capture pads, and higher connection pad densities. A high density PCB features blind and buried vias and often contains microvias that are .006 in diameter or even less.


HDI PCBs are characterized by high-density attributes including laser microvias, fine lines and high performance thin materials. This increased density enables more functions per unit area. Higher technology HDI PCBs have multiple layers of copper filled stacked microvias (Advanced HDI PCBs) which creates a structure that enables even more complex interconnections. These very complex structures provide the necessary routing solutions for today's large pin-count chips utilized in mobile devices and other high technology products.

The HDI PCBs we offer include the following highly requested characteristics:


Blind and/or buried vias
Via-in-pad
Through vias from surface to surface
20 µm circuit geometries
30 µm dielectric layers
50 µm laser vias
125 µm bump pitch processing

Applications


HDI PCB is used to reduce size and weight, as well as to enhance electrical performance of the device. HDI PCB is the best alternative to high layer-count and expensive standard laminate or sequentially laminated boards. HDI incorporate blind and buried vias that help to save PCB real estate by allowing features and lines to be designed above or below them without making a connection. Many of today's fine pitch BGA and flip-chip component footprints do not allow for running traces between the BGA pads. Blind and buried vias will only connect layers requiring connections in that area.





HDI PCB

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